Semiconductor-Metal-On-Insulator Structures, Methods of Forming Such Structures, and Semiconductor Devices Including Such Structures

ABSTRACT

Methods for fabricating semiconductor-metal-on-insulator (SMOI) structures include forming an acceptor wafer including an insulator material on a first semiconductor substrate, forming a donor wafer including a conductive material and an amorphous silicon material on a second semiconductor substrate, and bonding the amorphous silicon material of the donor wafer to the insulator material of the acceptor wafer. SMOI structures formed from such methods are also disclosed, as are semiconductor devices including such SMOI structures.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 12/715,704 that was filed Mar. 2, 2010, which is related toco-pending U.S. patent application Ser. No. 12/715,843 filed on Mar. 2,2010, and titled “FLOATING BODY CELL STRUCTURES, DEVICES INCLUDING SAME,AND METHODS FOR FORMING SAME”; co-pending U.S. patent application Ser.No. 12/715,743 filed on Mar. 2, 2010, and titled “SEMICONDUCTOR DEVICESINCLUDING A DIODE STRUCTURE OVER A CONDUCTIVE STRAP AND METHODS OFFORMING SUCH SEMICONDUCTOR DEVICES”; co-pending U.S. patent applicationSer. No. 12/715,889 filed on Mar. 2, 2010, and titled “THYRISTOR-BASEDMEMORY CELLS, DEVICES AND SYSTEMS INCLUDING THE SAME AND METHODS FORFORMING THE SAME”; and co-pending U.S. patent application Ser. No.12/715,922 filed on Mar. 2, 2010, and titled “SEMICONDUCTOR CELLS,ARRAYS, DEVICES AND SYSTEMS HAVING A BURIED CONDUCTIVE LINE AND METHODSFOR FORMING THE SAME”, the disclosures of each of which are incorporatedherein by reference.

TECHNICAL FIELD

The present invention, in various embodiments, relates generally tosemiconductor structures including a buried conductive material, andmethods of forming such semiconductor structures. More specifically,embodiments of the present invention relate to asemiconductor-metal-on-insulator (SMOI) structure having a buriedconductive material and methods of forming such structure. Additionally,the present invention relates to semiconductor devices including suchSMOI structures and methods of forming such semiconductor devices.

BACKGROUND

One of the common trends in the electronics industry is theminiaturization of electronic devices. This is especially true forelectronic devices operated through the use of semiconductor microchips.Microchips are commonly viewed as the brains of most electronic devices.In general, a microchip comprises a small silicon wafer upon which canbe built millions or billions of nanoscopic electronic devices that areintegrally configured to form electronic circuits. The circuits areinterconnected in a unique way to perform a desired function.

With the desire to make high density microchips, it is necessary todecrease the size of the individual electronic devices and interconnectsthereon. This movement also known as the so called “scale down” movementhas increased the number and complexity of circuits on a singlemicrochip.

Conventionally, electronic devices are formed side-by-side in a singleplane on a common substrate, such as a silicon wafer. This side-by-sidepositioning, however, uses a relatively large amount of surface area, or“real estate,” on the substrate. As a result, devices may be formedvertically in an effort to utilize less substrate area. In order to becompetitive, such vertical devices are formed with high aspect ratios(i.e., the ratio of height to widths). However, as the aspect ratio of adevice increases, it becomes increasingly difficult to satisfy bothterritory and electronic requirements of the correspondinginterconnects. For this reason, simpler planar device scale downsdominate the industry in real practice to date.

A recent trend is to vertically stack semiconductor devices on asubstrate. However, the stacking of semiconductor devices adds anadditional complexity to connecting the components of the semiconductordevice as well as providing efficient interconnects between the stacks.

Accordingly, there is a need for a method of forming a verticalsemiconductor device which provides for competitive accessibility ofinterconnects to an electronic device in a stacked semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-6 are cross-sectional views of an SMOI structure during variousprocessing acts in accordance with one embodiment of the disclosure;

FIGS. 7-10 are cross-sectional views of an SMOI structure during variousprocessing acts in accordance with another embodiment of the disclosure;

FIGS. 11-14 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 15-18 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 19-21 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 22-28 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 29-31 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 32-34 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIGS. 35-38 are cross-sectional views of an SMOI structure duringvarious processing acts in accordance with another embodiment of thedisclosure;

FIG. 39 is a perspective view of one embodiment of a semiconductordevice including an SMOI structure of the disclosure;

FIG. 40 is a perspective view of another embodiment of a semiconductordevice including an SMOI structure of the disclosure;

FIG. 41 is a cross-sectional view of another embodiment of asemiconductor device including an SMOI structure of the disclosure;

FIG. 42 is a perspective view of another embodiment of a semiconductordevice including an SMOI structure of the disclosure; and

FIG. 43 is a perspective view of another embodiment of a semiconductordevice including an SMOI structure of the disclosure.

FIG. 44 is a schematic block diagram illustrating one embodiment of anelectronic system that includes a semiconductor device including an SMOIstructure of the disclosure.

DETAILED DESCRIPTION

A semiconductor-metal-on-insulator (SMOI) structure and methods offorming such an SMOI structure. Such structures include, in oneembodiment, an insulator material on a first semiconductor substrate, anamorphous silicon material bonded to the insulator material, aconductive material over the amorphous silicon material, and a secondsemiconductor substrate over the conductive material. Methods of formingsuch structures include, in one embodiment, forming an acceptor waferincluding an insulator material formed over a first semiconductorsubstrate, forming a donor wafer including forming a conductive materialover a precursor semiconductor substrate, forming an amorphous siliconmaterial over the conductive material, and implanting ions into theprecursor semiconductor substrate at a depth to form an implanted zone.The amorphous silicon material of the donor wafer may be bonded to theinsulator material of the acceptor wafer. A portion of the precursorsemiconductor substrate above the implanted zone may then be removed.

The SMOI structures formed in accordance with the various embodiments ofthe disclosure include an amorphous silicon material bonded to aninsulator material, a conductive material, or an additional amorphoussilicon material. The amorphous silicon material exothermicallycrystallizes or reacts with the insulator material, the conductivematerial, or the additional amorphous silicon material, which allows forsilicon atom rearrangement, which can improve the bond strength at theinterface between the amorphous silicon material and the insulatormaterial, the conductive material, or the additional silicon material.As such, the bond created between the amorphous silicon material and theat least one of the insulator material, the conductive material, and theadditional amorphous silicon material may be substantially stronger thana bond created between two insulator materials, such as two oxidematerials. Additionally, the bonding of the amorphous silicon materialto the insulator material may occur at a relatively low temperature,such as at room temperature (from approximately 20° C. to approximately25° C.), and, thus, reduces the risk of damage to any underlying devicesformed on the first semiconductor substrate. Bonding of the amorphoussilicon material to the at least one of the insulator material, theconductive material, and the additional amorphous silicon material isdescribed in greater detail below. The SMOI structures formed inaccordance with the various embodiments of the disclosure may alsoinclude a conductive material disposed between the insulator materialand the second semiconductor substrate. The conductive material isburied beneath the second semiconductor substrate. The conductivematerial may be used, in some embodiments, to form an interconnect, suchas a word line or a bit line, or to form a metal strap. Such aninterconnect may be used to facilitate access to a semiconductor deviceformed in the second semiconductor substrate.

The SMOI structures formed in accordance with various embodiments of thedisclosure may be used to fabricate a variety of semiconductor devices,such as an integrated circuit including a logic device formed in/on thefirst semiconductor substrate and a memory device formed in/on thesecond semiconductor substrate. Since the conductive material is buriedbeneath the second semiconductor substrate, devices formed on the secondsemiconductor substrate may be formed in relatively few process acts, asdescribed in greater detail below. Additionally, the devices formedon/in the second semiconductor substrate may be self-aligned with theunderlying interconnect and/or source and drain contacts, thuseliminating the need for a separate electrical contact. Furthermore,since a logic device may be formed on the first semiconductor substratebefore the SMOI structure and the memory device are formed, the memorydevice is not exposed to the processing conditions used for theformation of the logic device. By forming such vertical, self-aligned,stacked integrated circuits, the cell size may be reduced, whichprovides for increased cache memory density.

The following description provides specific details, such as materialtypes and processing conditions, in order to provide a thoroughdescription of embodiments of the disclosure. However, a person ofordinary skill in the art will understand that embodiments of thepresent invention may be practiced without employing these specificdetails and in conjunction with conventional fabrication techniques. Inaddition, the description provided herein does not form a completeprocess flow for manufacturing a semiconductor device including the SMOIstructure. Only those process acts and structures necessary tounderstand the embodiments of the disclosure are described in detailbelow. Additional acts to form a complete semiconductor device includingthe SMOI structure according to an embodiment of the invention may beperformed by conventional techniques. In addition, it is understood thatthe methods described herein may be repeated as many times as desired toform multiple, stacked SMOI structures.

The materials described herein may be formed by any suitable techniqueincluding, but not limited to, spin coating, blanket coating, chemicalvapor deposition (“CVD”), plasma enhanced chemical vapor deposition(“PECVD”), atomic layer deposition (“ALD”), plasma enhanced ALD, orphysical vapor deposition (“PVD”). Alternatively, materials may be grownin situ. A technique suitable for depositing or growing a particularmaterial may be selected by a person of ordinary skill in the art. Whilethe materials described and illustrated herein may be formed as layers,the materials are not limited thereto and may be formed in otherthree-dimensional configurations.

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shown,by way of illustration, specific embodiments in which the invention maybe practiced. These embodiments are described in sufficient detail toenable a person of ordinary skill in the art to practice the invention.However, other embodiments may be utilized, and structural, logical, andelectrical changes may be made without departing from the scope of theinvention. The illustrations presented herein are not meant to be actualviews of any particular system, logic device, memory cell, orsemiconductor device, but are merely idealized representations which areemployed to describe embodiments of the disclosure. The drawingspresented herein are not necessarily drawn to scale. Additionally,elements common between drawings may retain the same numericaldesignation.

Referring now to the drawings, where like elements are designated bylike reference numerals, FIGS. 1 through 6 are partial cross-sectionalviews of a method of forming an embodiment of an SMOI structure 30 (FIG.6) including a conductive material 204, which is buried. The SMOIstructure 30 is formed by bonding an acceptor wafer 10 (FIG. 1) and adonor wafer 20 (FIG. 2). FIG. 1 depicts the acceptor wafer 10. Theacceptor wafer 10 may include a first semiconductor substrate 102 havingan insulator material 104 formed thereon. The first semiconductorsubstrate 102 may include a fabrication substrate, such as a full orpartial wafer of semiconductor material (e.g., silicon, galliumarsenide, indium phosphide, etc.), a full or partialsilicon-metal-on-insulator (SMOI) type substrate, such as asilicon-on-glass (SOG), silicon-on-ceramic (SOC), or silicon-on-sapphire(SOS) substrate, or any other known, suitable fabrication substrate. Asused herein, the term “wafer” includes conventional wafers as well asother bulk semiconductor substrates. The first semiconductor substrate102 may be doped or undoped. An at least partially fabricated logicdevice (not shown), such as a CMOS device, may optionally be present onthe first semiconductor substrate 102 and may be formed by conventionaltechniques. In one embodiment, the first semiconductor substrate 102 isbulk crystalline silicon.

The insulator material 104 may be a dielectric material including, byway of non-limiting example, silicon dioxide, borophosphosilicate glass(BPSG), borosilicate glass (BSG), phosphosilicate glass (PSG) or thelike. In one embodiment, the insulator material 104 is a buried oxide.The insulator material 104 may be from about 500 Å to about 2 μm thick,such as from about 1000 Å to about 2000 Å. Techniques for deposition andin situ growth of such dielectric materials are known in the art and mayinclude, for example, chemical vapor deposition (CVD), such as lowpressure CVD or plasma enhanced CVD, atomic layer deposition (ALD),spin-on deposition, thermal decomposition, or thermal growth. Theinsulator material 104 includes an upper surface 106.

FIG. 2 is a partial cross-sectional view of one embodiment of the donorwafer 20 used to form the SMOI structure 30 (FIG. 6). The donor wafer 20may include a precursor semiconductor substrate 202 having a conductivematerial 204 and an amorphous silicon material 206 formed thereon. Insome embodiments, a polysilicon material or another amorphous material,such as amorphous germanium, may be substituted for the amorphoussilicon material 206. The precursor semiconductor substrate 202 may be,for example, one of the fabrication substrates mentioned above for useas first semiconductor substrate 102. In one embodiment, the precursorsemiconductor substrate 202 is a silicon substrate, such as acrystalline silicon substrate. The precursor semiconductor substrate 202may be doped or undoped. The conductive material 204 may be a lowresistivity material including, but not limited to, a phase changematerial, titanium, titanium silicide, titanium oxide, titanium nitride,tantalum, tantalum silicide, tantalum oxide, tantalum nitride, tungsten,tungsten silicide, tungsten oxide, tungsten nitride, other metal, metalsilicide, metal oxide, or metal nitride materials, or combinationsthereof, including multiple, different conductive materials. In oneembodiment, the conductive material 204 may be formed from titaniumnitride because titanium nitride has good adherence or adhesion to manymaterials, such as the material used as the precursor semiconductorsubstrate 202. Titanium nitride also has a high melting point (about3000° C.), which makes it unaffected by high processing temperatures.Titanium nitride also makes excellent ohmic contact with otherconductive materials. Titanium nitride is also commonly used insemiconductor fabrication and, therefore, may easily be incorporatedinto conventional fabrication processes. In one embodiment, theconductive material 204 is a titanium-rich titanium nitride, such asmetal mode titanium nitride (MMTiN). The conductive material 204 mayalso be formed from multiple conductive materials. In one embodiment,the conductive material 204 is a MMTiN material over the precursorsemiconductor substrate 202 and a tungsten silicide material over theMMTiN material. In another embodiment, the conductive material 204 maybe formed from a metal, such as titanium, tungsten or aluminum, with alayer of titanium material formed thereon. The thickness of theconductive material 204 may be optimized, depending on the material, toprovide a low ohmic contact between the conductive material 204 and theprecursor semiconductor substrate 202. For example, if the conductivematerial 204 is titanium nitride, such as MMTiN, the conductive material204 may have a thickness of from about 10 nm to about 50 nm. Theconductive material 204 may be formed by a deposition technique known inthe art, such as, for example, atomic layer deposition (ALD), chemicalvapor deposition (CVD), or plasma vapor deposition (PVD).

The amorphous silicon material 206 may be formed over the conductivematerial 204 by a deposition technique known in the art, such as, forexample, ALD, CVD, or PVD. In one embodiment, the amorphous siliconmaterial 206 may be formed on the conductive material 204 by PVD,followed by chemical mechanical planarization (CMP). The amorphoussilicon material 206 may be of sufficient thickness to adhere to theinsulator material 104 of the acceptor wafer 10 as described in greaterdetail below. For example, the thickness of the amorphous siliconmaterial 206 may be from about 10 nm to about 50 nm. The amorphoussilicon material 206 includes a surface 212.

As depicted in FIG. 2, the donor wafer 20 may also include a cleaveportion 208 formed by implanting an atomic species into the precursorsemiconductor substrate 202. The atomic species may be hydrogen ions,ions of rare gases, also termed inert or noble gases, or ions offluorine. The atomic species may be implanted into the precursorsemiconductor substrate 202 of the donor wafer 20 to form an implantedzone 210. The atomic species may be implanted into the precursorsemiconductor substrate 202 prior to formation of the conductivematerial 204 thereon, after formation of the conductive material 204thereon, or after formation of the amorphous silicon material 206thereon. The implanted zone 210 may be formed at a desired depth in theprecursor semiconductor substrate 202, which is dependent on parameters,such as implant dose and energy of the atomic species, as known in theart. The depth of the implanted zone 210 may correspond to the thicknessof a second semiconductor substrate 202′ of the SMOI structure 30 (FIG.6). The implanted zone 210 may include microbubbles or microcavitiesincluding the implanted atomic species, which provide a weakened regionwithin the precursor semiconductor substrate 202. The donor wafer 20 maybe thermally treated at a temperature above that at which implantationis effected, but below the melting temperature of the conductivematerial 204, to effect crystalline rearrangement in the donor wafer 20and coalescence of the microbubbles or microcavities. As describedbelow, the donor wafer 20 may be cleaved at the implanted zone 210,forming the second semiconductor substrate 202′ on the SMOI structure 30(FIG. 6) and cleave portion 208. For clarity, the term “secondsemiconductor substrate” is used herein to refer to the semiconductorstructure after removal of the cleave portion 208, while the term“precursor semiconductor substrate” is used herein to refer to thesemiconductor structure before removal of the cleave portion 208.

As shown in FIG. 3, the donor wafer 20 may be superposed onto theacceptor wafer 10 such that the amorphous silicon material 206 of thedonor wafer 20 is in contact with the insulator material 104 of theacceptor wafer 10. The amorphous silicon material 206 of the donor wafer20 may then be bonded to the insulator material 104 of the acceptorwafer 10 by exposure to heat. Prior to bonding the donor wafer 20 to theacceptor wafer 10, at least one of the surface 212 of the amorphoussilicon material 206 and the upper surface 106 of the insulator material104 may, optionally, be treated to improve the bond strength between theamorphous silicon material 206 and the insulator material 104. Suchtreatment techniques are known in the art and may include chemical,plasma, or implant activations. For example, the upper surface 106 ofthe insulator material 104 may be treated with a dilute ammoniahydroxide or hydrogen fluoride solution. The surface 212 of theamorphous silicon material 206 may also be exposed to a plasma of, forexample, argon, to form a plasma-activated surface. Activating at leastone of the surface 212 of the amorphous silicon material 206 and theupper surface 106 of the insulator material 104 may increase thekinetics of the subsequent bonding therebetween due to an increasedmobility of ionic species (for example, hydrogen) created on the surface212 of the amorphous silicon material 205 and the upper surface 106 ofthe insulator material 104.

As shown in FIG. 4, the amorphous silicon material 206 of the donorwafer 20 may be contacted and bonded with the insulator material 104 ofthe acceptor wafer 10 to form a precursor of the SMOI structure 30. Theamorphous silicon material 206 may be bonded to the insulator material104 by, for example, heating the SMOI structure 30 to a temperature ofless than about 600° C., such as from about 300° C. to about 400° C. Ifthe insulator material 104 is formed from silicon dioxide, silicon-oxidebonds may form between the amorphous silicon material 206 and theinsulator material 104. Because the conductive material 204 may beformed of a metal or other heat sensitive material, the temperature towhich the SMOI structure 30 is exposed may be less than the meltingpoint of the conductive material 204. The amorphous silicon material 206and the insulator material 104 may also be bonded without heat, such asat ambient temperature (from about 20° C. to about 25° C.). Pressure mayalso be applied to the donor wafer 20 and the acceptor wafer 10 to bondthe amorphous silicon material 206 to the insulator material 104. Oncethe donor wafer 20 is bonded to the acceptor wafer 10, the conductivematerial 204 from the donor wafer 20 may form a buried conductivematerial, which is disposed between the insulator material 104 and theprecursor semiconductor substrate 202.

To form the SMOI structure 30 (FIG. 6), the cleave portion 208 may beremoved from the precursor semiconductor substrate 202, as shown in FIG.5. The cleave portion 208 may be removed by techniques known in the art,such as by applying a shear force to the implanted zone 210 or byapplying heat or a jet gas stream at the implanted zone 210. Thehydrogen or other ions implanted in the implanted zone 210 produce aweakened region in the precursor semiconductor substrate 202, which issusceptible to cleavage. The remaining portion of the secondsemiconductor substrate 202′ may have a thickness, for example, of fromabout 50 nm to about 500 nm (from about 500 Å to about 5000 Å). Asurface 302 of the SMOI structure 30, exposed after removing the cleaveportion 208, may be rough and jagged. The exposed surface 302 of theSMOI structure 30 may be smoothed to a desired degree in order tofacilitate further processing of the SMOI structure 30, as describedbelow. The exposed surface 302 of the SMOI structure may be smoothedaccording to conventional techniques such as, for example, one or moreof grinding, wet etching, chemical-mechanical polishing (CMP), andplanar reactive ion etching (RIE).

The SMOI structure 30 and the other structures described below may beformed by modification of SMART-CUT® layer transfer technology. TheSMART-CUT® layer transfer technology is described in detail in, forexample, U.S. Pat. No. RE 39,484 to Bruel, U.S. Pat. No. 6,303,468 toAspar et al., U.S. Pat. No. 6,335,258 to Aspar et al., U.S. Pat. No.6,756,286 to Moriceau et al., U.S. Pat. No. 6,809,044 to Aspar et al.,U.S. Pat. No. 6,946,365 to Aspar et al., and U.S. Patent ApplicationPublication No. 2006/0099776 to Dupont. However, other processessuitable for manufacturing an SMOI substrate may also be used, ifsufficiently low process temperatures are maintained. In conventionalimplementation of the SMART-CUT® layer transfer technology, donor wafersand acceptor wafers are bonded together using a high temperature anneal.The temperature used to bond the donor and acceptor wafers is from about1000° C. to about 1300° C. However, due to the presence of theconductive material 204 in the SMOI structures described herein, theSMOI structures of the disclosure may, in some circumstances, be unableto withstand exposure to such temperatures without thermal damage.Accordingly, as described above, lower temperatures may be used to bondand acceptor wafer 10 and donor wafer 20.

FIG. 6 is an illustration of the SMOI structure 30 after the exposedsurface 302 has been smoothed. Once the donor wafer 20 is bonded to theacceptor wafer 10 and the exposed surface 302 smoothed, then asemiconductor device, such as a memory cell, may be formed on and/orwithin the second semiconductor substrate 202′ of the SMOI structure 30.As described below, the conductive material 204 of the SMOI structure 30may function as, for example, an interconnect, such as a bit line orword line, as a gate, or as a metal strap.

FIGS. 7 through 10 are partial cross-sectional views of a method offorming an embodiment of an SMOI structure 50 (FIG. 10) including aconductive silicide material 410, which is buried. FIG. 7 illustrates anacceptor wafer 11 used to form the SMOI structure 50 (FIG. 10). Theacceptor wafer 11 may be substantially similar to the acceptor wafer 10described above and may be formed as described above regarding FIG. 1,with the exception that the amorphous silicon material 206 may be formedover the insulator material on the acceptor wafer 10. As shown in FIG.7, the acceptor wafer 10 may include the amorphous silicon material 206formed over the insulator material 104 and the insulator material 104formed over the first semiconductor substrate 102.

FIG. 8 is a partial cross-sectional view of one embodiment of a donorwafer 40 used to form the SMOI structure 50 (FIG. 10). The donor wafer40 may be substantially similar to the donor wafer 20 described aboveand may be formed as described above regarding FIG. 2, with theexception that the donor wafer 40 may include an optional non-reactiveconductive material 402 and a reactive conductive material 404 insteadof conductive material 204 (FIG. 2), and the amorphous silicon material206 (FIG. 2) is not formed on the donor wafer 40. The non-reactiveconductive material 402 may be formed of, for example, a metal nitride,such as titanium nitride. However, any conductive material that will notchemically react with the reactive conductive material 404 or a reactionproduct thereof may be used. The thickness of the non-reactiveconductive material 402 may be relatively thin compared to the thicknessof the reactive conductive material 404. For example, the non-reactiveconductive material 402 may have a thickness of from about 20 Å to about200 Å. The reactive conductive material 404 may be formed of a metalcapable of reacting with the amorphous silicon material 206 or acts as acatalyst for crystallizing the amorphous silicon material 206. In oneembodiment, the reactive conductive material 404 is titanium. Thereactive conductive material 404 may have a thickness of from about 200Å to about 500 Å. The non-reactive conductive material 402 and thereactive conductive material 404 may be formed by a deposition techniqueknown in the art, such as, for example, ALD, CVD, or PVD.

As shown in FIG. 9, the donor wafer 40 may be superposed onto theacceptor wafer 10 and bonded thereto and the cleave portion 208 (FIG. 8)removed, as previously described regarding FIGS. 3-6. The resulting SMOIstructure 50 may include the first semiconductor substrate 102, theinsulator material 104, the amorphous silicon material 206, the reactiveconductive material 404, the non-reactive conductive material 402, andthe second semiconductor substrate 202′.

As shown in FIG. 10, the SMOI structure 50 may be annealed so that thereactive conductive material 404 chemically reacts with the amorphoussilicon material 206, forming the conductive silicide material 410,which is buried beneath the non-reactive conductive material 402. Thereactive conductive material 404 may be formed from titanium, whichreacts with the amorphous silicon material 206 to form titanium silicideas the conductive silicide material 410. The reactive conductivematerial 404 and the non-reactive conductive material 402 may also be asingle material, such as titanium-rich titanium nitride (MMTi). Excesstitanium in the titanium-rich titanium nitride may react with theamorphous silicon material 206, forming the conductive silicide material410. Annealing the SMOI structure 50 to form the conductive silicidematerial 410 may occur at a temperature of, for example, from about 600°C. to about 800° C. The bond strength between the conductive silicidematerial 410 and the insulator material 104 may be greater than thatbetween the amorphous silicon material 206 and the insulator material104. The conductive silicide material 410 may provide a lower resistanceto the SMOI structure 50 than the reactive conductive material 404.

FIGS. 11 through 14 are partial cross-sectional views of a method offorming an embodiment of an SMOI structure 70 (FIG. 14) including aconductive material, which is buried beneath a doped semiconductorsubstrate. FIG. 11 illustrates an acceptor wafer 10, which is asubstantial duplication of FIG. 1 and may be formed as described aboveregarding FIG. 1. As shown in FIG. 11, the acceptor wafer may includethe insulator material 104 formed over the first semiconductor substrate102.

FIG. 12 is a partial cross-sectional view of one embodiment of a donorwafer 60 used to form the SMOI structure 70 (FIG. 14). The donor wafer60 may include a precursor semiconductive substrate 202 similar to thedonor wafer 20 described above and may be formed as described aboveregarding FIG. 2. The precursor semiconductive substrate 202 may bedoped and activated, as known in the art, to form a P+ doped region 602,an N− doped region 604, and an N+ doped region 606. In one embodiment,the precursor semiconductive substrate 202 may be doped using a hightemperature process since the precursor semiconductive substrate doesnot yet include a MMTiN material 610 (FIG. 13) which may be damaged bysuch high temperature processes. In another embodiment, the P+ dopedregion 602 may be formed after the SMOI device 70 (FIG. 14) has beenformed using a low temperature process for better dopant profilecontrol. While FIG. 12 is depicted as including a particular order ofthe P+ doped region 602, the N− doped region 604, and the N+ dopedregion 606, it is understood that one of ordinary skill in the art maychoose any combination of doped regions to achieve desired functions forthe SMOI structure 70 (FIG. 14). Because the donor wafer 60 has twoexposed surfaces from which the desired dopant may be implanted, thedepth and concentration (i.e. highly doped or lightly doped) of thedoped regions 602, 604, 606 may be more easily and accurately controlledthan if the doped regions were formed after the donor wafer 60 is bondedto the acceptor wafer 10. As shown in FIG. 12, a silicide material 608may be formed over the precursor semiconductor substrate 202, such asover the N+ doped region 606. The silicide material 608 may be formed byforming reactive conductive material over the precursor semiconductorsubstrate 202 so that the reactive conductive material reacts with theprecursor semiconductor substrate 202 to form the silicide material 608.The silicide material 608 may have a low ohmic contact with theprecursor semiconductor substrate 202. A metal mode titanium nitride(MMTiN) material may be formed over the silicide material 608. MMTiNmaterial 610 and tungsten silicide material 612 may be formed by adeposition technique known in the art, such as, for example, ALD, CVD,or PVD. The thickness of the silicide material 608 may be relativelythin compared to the thickness of the MMTiN material 610. For example,the silicide material 608 may have a thickness of from about 50 Å toabout 500 Å. The MMTiN material 610 may have a thickness of from about500 Å to about 1000 Å. Also, as depicted in FIG. 12, the cleave portion208 may be formed by implanting an atomic species into the precursorsemiconductor substrate 202, forming the implanted zone 210 aspreviously described regarding FIG. 2. As shown in FIG. 12, theimplanted zone 210 may be formed within the P+ doped region 602 of theprecursor semiconductor substrate 202. The silicide material 608 and theMMTiN material 610 may have a substantially minimal impact on theimplanting of the atomic species when forming the implanted zone 210.

As shown in FIG. 13, a tungsten silicide material 612 and an amorphoussilicon material 206 may be formed over the silicide material 608. Thetungsten silicide material 612 may be formed by a deposition techniqueknown in the art, such as, for example, ALD, CVD, or PVD. The tungstensilicide material 612 may be a better conductor than the MMTiN nitridematerial 610. In some embodiments, the tungsten silicide material 612may be formed over the titanium silicide material 612 and MMTiN material610 after the implanted zone 210 is formed.

As shown in FIG. 14, the donor wafer 60 may be superposed onto theacceptor wafer 10 and bonded thereto and the cleave portion 208 (FIG.13) removed, as previously described regarding FIGS. 3-6. The resultingSMOI structure 70 may include the first semiconductor substrate 102, theinsulator material 104, the amorphous silicon material 206, the tungstensilicide material 612, the MMTiN material 610, the silicide material608, and the second semiconductor substrate 202′ including the N+ dopedregion 606, the N− doped region 604, and the P+ doped region 602. Insome embodiments, a second conductive material (not shown) may be formedover the P+ doped region 602 to form a top electrode which may be usedto form a semiconductor device as described in greater detail below.

FIGS. 15 through 18 are partial cross-sectional views of another methodof forming an embodiment of an SMOI structure 90 (FIG. 18) including adoped semiconductor material. FIG. 15 is a substantial duplication ofFIG. 1 and may be formed as described above regarding FIG. 1. As shownin FIG. 15, the acceptor wafer 10 includes the insulator material 104formed over the first semiconductor substrate 102.

FIG. 16 is a partial cross-sectional view of one embodiment of a donorwafer 80 used to form the SMOI structure 90 (FIG. 18). The donor wafer80 may be substantially similar to the donor wafer 20 describedregarding FIG. 2 above and may be formed as described above regardingFIG. 2, with the exception that the donor wafer 80 may include a dopedsemiconductive material 802 disposed between the precursor semiconductorsubstrate 202 and the conductive material 204. The doped semiconductivematerial 802 may be formed of, for example, at least one of germanium(Ge), silicon carbide (SiC) and gallium nitride (GaN). The precursorsemiconductor substrate 202 may be doped to form at least one P+ or N+doped region 804. The doped semiconductive material 802 may also bedoped to form a P doped region 806 and an N doped region 808. In oneexample, the P doped region 806 may include a P doped silicon carbidematerial adjacent the P+ or N+ doped region 804 of the precursorsemiconductor substrate 202 and the N-doped region 808 may include an Ndoped silicon carbide material adjacent the P doped region 806. Thedoped semiconductive material 802 may be formed on the precursorsemiconductor substrate 202 using conventional deposition or in situgrowth techniques and may include, for example, chemical vapordeposition (CVD), such as low pressure CVD or plasma enhanced CVD,atomic layer deposition (ALD), spin-on deposition, thermaldecomposition, or thermal growth. The conductive material 204 and theamorphous silicon material 206 may be deposited over the dopedsemiconductive material 802, and the precursor semiconductor substrate202 may be implanted with an atomic species to form the implanted zone210 and the cleave portion 208 as described above regarding FIG. 2.

As shown in FIG. 17, the donor wafer 80 may be superposed onto theacceptor wafer 10 and bonded thereto and the cleave portion 208 removedas previously described regarding FIGS. 3-6. The resulting SMOIstructure 90 includes the first semiconductor substrate 102, theinsulator material 104, the amorphous silicon material 206, theconductive material 204, the doped semiconductive material 802 includingthe N doped region 808 and the P doped region 806, and the secondsemiconductor substrate 202′ including the P+ or N+ doped region 804. Asshown in FIG. 18, the second semiconductor substrate 202′ may bepolished using techniques known in the art, such as CMP.

FIGS. 19 through 21 are partial cross-sectional views of another methodof forming an embodiment of an SMOI structure 120 (FIG. 21) includingthe insulator material 104 and a high-k dielectric material 112. FIG. 19is a substantial duplication of FIG. 1 and may be formed as describedabove regarding FIG. 1. As shown in FIG. 19, the acceptor wafer 10includes the insulator material 104 formed over the first semiconductorsubstrate 102.

FIG. 20 is a partial cross-sectional view of one embodiment of a donorwafer 110 used to form the SMOI structure 120 (FIG. 21). The donor wafer110 may be substantially similar to the donor wafer 20 describedregarding FIG. 2 above and may be formed as described above regardingFIG. 2, with the exception that the donor wafer 110 includes a high-kdielectric material 112 disposed between the precursor semiconductorsubstrate 202 and the conductive material 204. The high-k dielectricmaterial 112 may be formed of, for example, silicon dioxide, hafniumoxide, and other oxides, silicates, or aluminates of zirconium,aluminum, lanthanum, strontium, titanium, or combinations thereofincluding but not limited to Ta₂O₅, ZrO₂, HfO₂, TiO₂, Al₂O₃, Y₂O₃,La₂O₃, HfSiO_(x), ZrSiO_(x), LaSiO_(x), YSiO_(x), ScSiO_(x), CeSiO_(x),HfLaSiO_(x), HfAlO_(x), ZrAlO_(x), and LaAlO_(x). In addition,multi-metallic oxides may be used, as may hafnium oxynitride, iridiumoxynitride and other high-k dielectric materials in either single orcomposite layers. The high-k dielectric material 112 may be formed onthe precursor semiconductor substrate 202 using conventional depositionor in situ growth techniques and may include, for example, chemicalvapor deposition (CVD), such as low pressure CVD or plasma enhanced CVD,atomic layer deposition (ALD), spin-on deposition, thermaldecomposition, or thermal growth. Optionally, the donor wafer 110 mayalso include a metal 113 and a doped region 115. The metal 113 mayinclude, for example, a reactive conductor such as metal mode titanium(MMTi), titanium (Ti), tantalum (Ta), cobalt (Co), and nickel (Ni). Theconductive material 204 and the amorphous silicon material 206 may bedeposited over the high-k dielectric material 112 and the precursorsemiconductor substrate 202 may be implanted with an atomic species toform the implanted zone 210 and the cleave portion 208 as describedabove regarding FIG. 2.

As shown in FIG. 21, the donor wafer 110 may be superposed onto theacceptor wafer 10 and bonded thereto and the cleave portion 208 (FIG.20) removed as previously described regarding FIGS. 3-6. The resultingSMOI structure 120 includes the substrate 102, an insulator material104, the amorphous silicon material 206, the conductive material 204,the high-k dielectric material 112 and the second semiconductorsubstrate 202′.

FIGS. 22 through 28 are cross-sectional views of a method of forminganother embodiment of an SMOI structure 140 (FIG. 28) including apatterned conductive material 204′. FIG. 22 is a substantial duplicationof FIG. 1 and may be formed as described above regarding FIG. 1. Asshown in FIG. 22, the acceptor wafer 10 includes the insulator material104 formed over the first semiconductor substrate 102.

FIG. 23 is a partial cross-sectional view of one embodiment of a donorwafer 130 used to form the SMOI structure 140 (FIG. 28). The donor wafer130 includes the precursor semiconductor substrate 202 having theconductive material 204 and a cap material 132 formed thereon. The capmaterial 132 may be formed of a dielectric material, such as a nitridematerial or an oxide material. The cap material 132 may be formed bydeposition techniques known in the art including, but not limited to,ALD, CVD, or PVD.

As shown in FIG. 24, the cap material 132 and the conductive material204 may be patterned to form at least one structure 134 including thepatterned cap material 132′ and the patterned conductive material 204′.The cap material 132 and the conductive material 204 may be patternedusing techniques known in the art, such as photoresist masking andanisotropic etching. Alternatively, in some embodiments, the patternedcap material 132′ and the patterned conductive material 204′ may beformed as the at least one structure 134 using a damascene flow process,which is known in the art and is, therefore, not described in detailherein. As shown in FIG. 25, an interlevel dielectric material 136 maybe deposited over the at least one structure 134 of the patterned capmaterial 132′ and patterned conductive material 204′. The interleveldielectric material 136 may be used to electrically isolate the at leastone structure 134 from an adjacent structure 134. As shown in FIG. 26,the interlevel dielectric material 136 may be removed to expose an uppersurface of the patterned cap material 132′, such as by CMP, as known inthe art. The patterned cap material 132′ may act as a CMP stop.

As shown in FIG. 27, the amorphous silicon material 206 may be formedover the interlevel dielectric material 136 and the patterned capmaterial 132′. The donor wafer 130 may also be implanted with an atomicspecies forming the implanted zone 210 and the cleave portion 208 aspreviously described regarding FIG. 2. As shown in FIG. 28, the donorwafer 130 may be superposed onto the acceptor wafer 10 and bondedthereto and the cleave portion 208 removed as previously describedregarding FIGS. 3-6. The resulting SMOI structure 140 includes the firstsemiconductor substrate 102, the insulator material 104, the amorphoussilicon material 206, at least one structure 134 of the patterned capmaterial 132′ and the conductive material 204′, the at least onestructure 134 being electrically isolated by the interlevel dielectricmaterial 136, and the second semiconductor substrate 202′. Because thepillars 134 including the conductive material 204′ are patterned andseparated by the interlevel dielectric material 136, the conductivematerial 204′ may be used as an interconnect, such as a word line or abit line without further processing, as described in greater detailbelow.

In additional embodiments, the conductive material 204 may be formed onan acceptor wafer rather than a donor wafer. For example, FIGS. 29-31illustrate partial cross-sectional views of another method of forming anembodiment of an SMOI structure 170 (FIG. 31) including the conductivematerial 204. As shown in FIG. 29, an acceptor wafer 150 includes thefirst semiconductor substrate 102, the insulator material 104, and theconductive material 204. The acceptor wafer 150 may, optionally, includea bonding material 152. The bonding material 152 (if present) may beeither an amorphous silicon material, as previously described, or thebonding material 152 may be an oxide material, such as silicon dioxide.In some embodiments, the conductive material 204 may be patterned andfilled with an interlevel dielectric material (not shown) as describedabove regarding FIGS. 22-28.

FIG. 30 is a partial cross-sectional view of one embodiment of a donorwafer 160 used to form the SMOI structure 170 (FIG. 31). The donor wafer160 may include the precursor semiconductor substrate 202 and theamorphous silicon material 206. The donor wafer 160 may be implantedwith an atomic species forming the implanted zone 210 and the cleaveportion 208 as previously described regarding FIG. 2.

As shown in FIG. 31, the donor wafer 160 may be superposed onto theacceptor wafer 150 and bonded thereto, and the cleave portion 208 may beremoved as previously described regarding FIGS. 3-6. The resulting SMOIstructure 170 includes the first semiconductor substrate 102, theinsulator material 104, the conductive material 204, the bondingmaterial 152 (if present) bonded to the amorphous silicon material 206,and the second semiconductor substrate 202′.

In additional embodiments, multiple SMOI structures may be formed bycreating multiple layers of silicon material on a donor wafer. Forexample, FIGS. 32-34 illustrate partial cross-sectional views of anothermethod of forming an embodiment of an SMOI structure 200 (FIG. 32)including a conductive material 204. As shown in FIG. 32, an acceptorwafer 180 includes the first semiconductor substrate 102, the insulatormaterial 104, and the conductive material 204.

FIG. 33 is a partial cross-sectional view of one embodiment of a donorwafer 190 used to form the SMOI structure 200 (FIG. 34). The donor wafer190 may include the precursor semiconductor substrate 202, at least oneportion of a silicon-germanium (SiGe) material 192, and at least oneportion of an epitaxial (EPI) silicon material 194. The SiGe material192 and EPI silicon material 194 may be formed by methods known in theart and at any desired thickness. Additionally, the SiGe material 192and the EPI silicon material 194 may be doped or undoped. While FIG. 33shows one portion of the SiGe material 192 and one portion of the EPIsilicon material 194, multiple portions may be present by formingalternating portions of the SiGe material 192 and the EPI siliconmaterial 194. In some embodiments, the amorphous silicon material 206,illustrated in dashed lines, may be optionally formed over the uppermostportion of the EPI silicon material 194 or the SiGe material 192.Alternatively, in some embodiments, the amorphous silicon material 206may be omitted and the uppermost portion of the EPI silicon material 194or the SiGe material 192 may be bonded to the acceptor wafer 180. Thedonor wafer 190 may also be implanted with an atomic species, formingthe implanted zone 210 and the cleave portion 208 as previouslydescribed regarding FIG. 2.

As shown in FIG. 34, the donor wafer 190 may be superposed onto theacceptor wafer 180 and bonded thereto, and the cleave portion 208 may beremoved as previously described regarding FIGS. 3-6. The resulting SMOIstructure 200 includes the first semiconductor substrate 102, theinsulator material 104, the conductive material 204, the amorphoussilicon material 206 (if present), the at least one portion of the EPIsilicon material 194, the at least one portion of the SiGe material 192,and the second semiconductor substrate 202′. While FIG. 23 is depictedas bonding the amorphous silicon material 206 to the conductive material204, either of the EPI silicon material 194, the SiGe material 192, orthe amorphous silicon material 206 (if present) may be used to bond thedonor wafer 190 to the acceptor wafer 180. Once the SMOI structure 200is formed, portions of the SiGe material 192 may be removed, such as,for example, utilizing a wet undercut etch. The portions of the SiGematerial 192 that are removed may then be back filled with a dielectricmaterial (not shown), such as an oxide material or the removed portionsmay be left unfilled, forming an air gap (not shown). Replacing portionsof the SiGe material 192 with a dielectric material or an air gap may beused to form multiple SMOI structures on the substrate 102. In stillfurther embodiments, the SMOI structure 200 may be formed without theconductive material 204, thus forming multiple SMOI structures on thesubstrate 102 without the conductive material 204.

In additional embodiments, the SMOI structure may be formed with amulti-portion buried dielectric material. For example, FIGS. 35-38illustrate partial cross-sectional views of another method of forming anembodiment of an SMOI structure 250 (FIG. 38) including a multi-portionburied dielectric material 226. As shown in FIG. 35, an acceptor wafer220 includes the first semiconductor substrate 102, the insulatormaterial 104, at least one portion of an oxide material 222, and atleast one portion of a nitride material 224. In some embodiments, theinsulator material 104 may, optionally, be omitted. The oxide material222 and the nitride material 224 may be formed in alternating portions.The oxide material 222 and the nitride material 224 may be formed bymethods known in the art and at any desired thickness. While FIG. 35 isillustrated as including two portions of the oxide material 222alternating with two portions of the nitride material 224, it isunderstood that any number of portions of oxide material 222 and nitridematerial 224 may be present.

FIG. 36 is a partial cross-sectional view of one embodiment of a donorwafer 230 used to form the SMOI structure 250 (FIG. 38). The donor wafer230 may be substantially similar to the donor wafer 20 described abovein FIG. 2 and may be formed as described above regarding FIG. 2. Asshown in FIG. 36, the donor wafer 230 may include the precursorsemiconductor substrate 202 and the amorphous silicon material 206. Thedonor wafer 230 may also be implanted with an atomic species forming theimplanted zone 210 and the cleave portion 208.

As shown in FIG. 37, the donor wafer 230 may be superposed onto theacceptor wafer 220 and bonded thereto, and the cleave portion 208 may beremoved as previously described regarding FIGS. 3-6. A resulting SMOIstructure 240 includes the first semiconductor substrate 102, theinsulator material 104, at least one portion of the oxide material 222,at least one portion of the nitride material 224, the amorphous siliconmaterial 206, and the second semiconductor substrate 202′. While FIG. 37is depicted as bonding the amorphous silicon material 206 to the atleast one portion of the oxide material 222, any of the at least oneportion of the nitride material 224, the at least one portion of theoxide material 222, or an additional amorphous silicon material (notshown) may be used to bond the donor wafer 230 to the acceptor wafer220. Once the SMOI structure 240 is formed, portions of the nitridematerial 224 may be selectively removed, such as, for example, by aselective undercut utilizing a wet etch. The portions of the nitridematerial 224 that are removed may then be back filled with a conductivematerial 226, forming the SMOI structure 250 shown in FIG. 38. Replacingthe nitride material 224 with the conductive material 226 may be used toform an SMOI structure 250 having multiple layers of the conductivematerial 226, which is buried. While the layers of the conductivematerial 226 are shown as having equal thicknesses, it is understoodthat different layers of the conductive material 226 may have varyingthicknesses depending on the desired use of the SMOI structure 250. Themultiple layers of the conductive material 226 may be used to formmultiple interconnects, such as word lines and bit lines. In additionalembodiments, when forming a semiconductor device on/in the secondsemiconductor substrate 202′, only the uppermost portion of theconductive material 226 may be utilized to form a semiconductor deviceas described in greater detail below, and the lower portions ofconductive material 226 may remain intact. The lower portions ofconductive material 226 that remain intact may help improve the bondstrength and stability of the SMOI structure 250.

The SMOI structures 30, 50, 70, 90, 120, 140, 170, 200, 250 describedherein may be utilized to form numerous semiconductor devices as knownin the art including those described in U.S. Pat. No. 7,589,995 to Tanget al. entitled One-transistor Memory Cell with Bias Gate, U.S. PatentApplication Publication No. 2007/0264771 to Ananthan et al. entitledDual Work Function Recessed Access Device and Methods of Forming, U.S.patent application Ser. No. 12/410,207 to Tang et al. entitled Methods,Devices, and Systems Relating to Memory Cells Having a Floating Body,U.S. patent application Ser. No. 12/419,658 to Tang entitled Methods,Devices, and Systems Relating to Memory Cells Having a Floating Body.The disclosure of each of the foregoing documents is incorporated hereinin its entirety by this reference. The SMOI structures 30, 50, 70, 90,120, 140, 170, 200, 250 may be used to form any semiconductor devicewith two or more terminals. For example, the SMOI structures 30, 50, 70,90, 120, 140, 170, 200, 250 may be used to form dynamic random accessmemory (DRAM), resistive, non-volatile RAM (ReRAM), phase change RAM(PCRAM), one-time programmable read-only memory (OTP ROM), or cachememory devices.

FIG. 39 illustrates one example of an embodiment of a semiconductordevice 300 including an SMOI structure 301 having a conductive material304 buried beneath a second semiconductor substrate 312. The SMOIstructure 301 may include, for example, a first semiconductor substrate306, an insulator material 308, an amorphous silicon material 310, theconductive material 304, and the second semiconductor substrate 312. TheSMOI structure 301 may be formed in a manner analogous to that describedabove in regard to FIG. 1-6, 7-10, 11-14, 15-18, 19-21, 22-28, 32-34, or35-38.

The amorphous silicon material 310, the conductive material 304, and thesecond semiconductor substrate 312 may be patterned by conventionaltechniques in a first direction to form bit lines 314. Alternatively, ifthe SMOI structure 301 is formed in a manner analogous to that describedabove in regard to FIGS. 22-28, the conductive material 304 may alreadybe patterned in the first direction. The second semiconductor substrate312 may be patterned by conventional techniques in a second directionperpendicular to the first direction to form pillars 316 above the bitlines 314. The pillars 316 may be doped, as known in the art, to form adrain region 318, a source region 320, and a channel region 322.Alternatively, the second semiconductor substrate 312 may already bedoped as previously described regarding FIGS. 11-14 and 15-18. Since thedrain region 318, the source region 320, and the channel region 322 areformed vertically from the body of the pillars 316 and the pillar 316 isdirectly on top of the bit line 314, a higher device density may beachieved than with a conventional plan arrangement. A gate dielectric324 may be formed on the sidewalls of the pillars 316 adjacent thechannel regions 322. A gate 326 may also be formed on the sidewalls ofthe pillars 316 adjacent the gate dielectric 324. The gate dielectric324 and the gate 326 may be formed using conventional techniquesincluding conventional spacer etch techniques, which are not describedin detail herein.

By utilizing the SMOI structure 301 to form the semiconductor device300, the semiconductor device 300 may be formed in as few as threepatterning acts. As previously described, the second semiconductorsubstrate 312 may be patterned in a first direction to form bit lines314, the second semiconductor substrate 312 may be patterned in a seconddirection to form pillars 316 above the bit lines, and the gate 326 andthe gate dielectric 324 may be patterned to form gate 326 and the gatedielectric 324 on the sidewalls of the pillars 316. Additionally,because the drain region 318, the source region 320, and the channelregion 322 are formed from the pillar 316 above the bit line 314, noseparate contact is needed to electrically connect the bit line 314 andthe drain region 318. Furthermore, because a logic device (not shown)and back end of the line (BEOL) elements (not shown) may be formed onthe first semiconductor substrate 306 prior to forming the semiconductordevice 300, the semiconductor device 300 is not exposed to theprocessing conditions for forming the logic device and the BEOLelements. Avoiding exposure to such processing conditions may improvethe reliability of the semiconductor device 300.

FIG. 40 illustrates another embodiment of a semiconductor device 400including an SMOI structure 401 having a conductive material 403 buriedbeneath a second semiconductor substrate 412. The semiconductor device400 may include a memory cell coupled to an access device, such as adiode 422. The SMOI structure 401 may include, for example, a firstsemiconductor substrate 406, a dielectric material 408, an amorphoussilicon material 409, the conductive material 403, and the secondsemiconductor substrate 412. The SMOI structure 401 may be formed in amanner analogous to that described above in regard to FIG. 1-6, 7-10,11-14, 15-18, 19-21, 22-28, 32-34, or 35-38.

The amorphous silicon material 409, the conductive material 403, and thesecond semiconductor substrate 412 may be patterned by conventionaltechniques in a first direction to form word lines 415. Alternatively,if the SMOI structure 401 is formed in a manner analogous to thatdescribed above in regard to FIGS. 22-28, the conductive material 403may already be patterned in the first direction. A portion of the secondsemiconductor substrate 412 may be patterned in a second direction byconventional techniques to form a pillar 423. The second semiconductorsubstrate 412 may be doped by conventional techniques to form the diode422 over the word lines 415. For example, the second semiconductorsubstrate 412 may be formed of a single crystalline silicon material andmay be doped to form an N doped silicon material 414 and a P dopedsilicon material 416. The N doped silicon material 414 may include aportion of the second semiconductor substrate 412 extending over theword lines 415 which is not etched in the second direction. The P dopedsilicon material 416 may include the portion of the second semiconductorsubstrate 412 etched in the second direction to form the pillar 423.Alternatively, the second semiconductor substrate may already be dopedas previously described regarding FIGS. 11-14 and 15-18. A bottomelectrode 418 for the memory device 400 may be formed over the diode 412using conventional techniques. For example, in one embodiment, thematerial of the bottom electrode 418 may be deposited over the secondsemiconductor substrate 412 prior to patterning the second semiconductorsubstrate 412. The material of the bottom electrode 418 may then bepatterned and etched, using conventional techniques, simultaneously withthe patterning and etching of the second semiconductor substrate 412. Amemory medium 420, and a terminal electrode or bit line 424 may beformed over the diode 422 and in electrical communication therewith,using conventional techniques, which are not described in detail herein.

By utilizing the SMOI structure 401 to form the semiconductor device400, the semiconductor device 400 may be formed in as few as threepatterning acts. As previously described, the amorphous silicon material409, the conductive material 403, and the second semiconductor substrate412 may be patterned in a first direction to form word lines 415; thesecond semiconductor substrate 412 and the bottom electrode 418 may bepatterned in a second direction to form the diode 422 and the bottomelectrode 418; and the memory medium 420 and the bit line 424 may bepatterned to form the memory medium 420 and the bit line 424 above thediodes 422. Because the memory medium 420 is one of the last materialsto be deposited, phase change or resistant change materials may be usedas the memory medium 420 since the memory medium 420 may not be exposedto, and altered by, high processing temperatures.

FIG. 41 illustrates another embodiment of a semiconductor device 500including an SMOI structure 502 having a conductive material 504 buriedbeneath a second semiconductor substrate 514. The semiconductor device500 may include a floating body memory cell 501 formed over and/orwithin the SMOI structure 502. The SMOI structure 502 may include, forexample, a first semiconductor substrate 506, an insulator material 508,an amorphous silicon material 510, the conductive material 504, a high-kgate dielectric material 512, and the second semiconductor substrate514. The SMOI structure 502 may be formed in a manner analogous to thatdescribed above in regard to FIGS. 29-31.

The floating body memory cell 501 includes an active region 516surrounded on the sides by an additional insulator material 518. Theactive region 516 may be formed from the monocrystalline silicon of thesecond silicon substrate 514. The entire thickness of the second siliconsubstrate 514 may be used to form the floating body memory cell 501 asshown in FIG. 33, the underlying high-k gate dielectric material 512forming a back gate-dielectric and the conductive material 504 forming ametal back gate. Source and drain regions 526 may be formed by dopingportions of the active region 516. The source and drain regions 526 willbe doped differently than the active region 516. For example, the activeregion 516 may include P doped silicon while the source and drainregions 526 include N doped silicon.

As shown in FIG. 41, a second high-k material for a gate dielectric 520is formed on the active region 516. The material for high-k gatedielectric 520 has a dielectric constant that is greater than that ofsilicon dioxide. Examples of a suitable material for high-k gatedielectric 520 include hafnium silicate, zirconium silicate, hafniumdioxide, or zirconium dioxide. A field-effect transistor (FET) gate 522is formed on the high-k gate dielectric 520. The FET gate 522 andunderlying high-k gate dielectric 520 may then be defined usingconventional photolithographic techniques in combination with suitableetch processes, as known in the art. Spacers 524 may be formed flankingthe sides of the FET gate 522 using conventional techniques, which arenot described in detail herein.

By utilizing the SMOI structure 502 to form the semiconductor device500, the floating body memory cell 501 may be formed in electricalcommunication with the conductive material 504, thus eliminating theneed for an additional electrical contact between the floating bodymemory cell 501 and the conductive material 504. Additionally, because alogic device (not shown) and back end of the line (BEOL) elements (notshown) may be formed on the first semiconductor substrate 506 prior toforming floating body memory cell 501, the floating body memory cell 501is not exposed to the processing conditions used to form the logicdevice and the BEOL elements. Avoiding exposure to such processingconditions may improve the reliability of the semiconductor device 500.

FIG. 42 illustrates another embodiment of a semiconductor device 600including an SMOI structure 601 having a conductive material 603 buriedbeneath a second semiconductor substrate 614. The SMOI structure 601 mayinclude, for example, a first semiconductor substrate 605, an insulatormaterial 607, an amorphous silicon material 609, the conductive material603, a dielectric material 611 and a second semiconductor substrate 614.The SMOI structure 601 may be formed in a manner analogous to thatdescribed above in regard to FIGS. 29-31.

The second semiconductor substrate 614 may be patterned and doped, asknown in the art, to form a floating body region 616, a drain region 618and a source region 619. The second semiconductor substrate 614 may befurther patterned to form a recess in the floating body region 616between the drain region 618 and the source region 619. A word line 620may be formed in the recess. A dielectric material 622 may be formedbetween the word line 620 and the floating body region 616. The buriedconductive material 603 acts as a buried gate for the memory cell. Acontact 624 may be formed above the drain region 618 leading to a bitline 626. The contact 624 may comprise, for example, a N+ dopedpolysilicon plug or a metal plug. A common source 628 may be formedabove the source region 619.

FIG. 43 illustrates a semiconductor device 700 including a plurality ofthe semiconductor devices 600 (FIG. 42). As illustrated in FIG. 43, theamorphous silicon material 609, the conductive material 603 and thedielectric material 611 may also be etched to form rows which areparallel to the bit lines 626. Similarly, in additional embodiments, theamorphous silicon material 609, the conductive material 603 and thedielectric material 611 may be etched to form rows (not shown) which areparallel to the bit lines 626.

By utilizing the SMOI structure 601 to form the semiconductor device700, the floating body region 616 may be formed on top of the conductivematerial 603, thus eliminating the need for an additional electricalcontact between the floating body region 616 and the conductive material603. Additionally, because a logic device (not shown) and back end ofthe line (BEOL) elements (not shown) may be formed on the firstsemiconductor substrate 605 prior to forming floating body region 616,the floating body region 616 is not exposed to the processing conditionsused for forming the logic device and the BEOL elements. Avoidingexposure of the floating body region 616 to such processing conditionsmay improve the reliability of the semiconductor device 600.

Semiconductor devices, such as those previously described herein, may beused in embodiments of electronic systems of the present invention. Forexample, FIG. 44 is a schematic block diagram of an illustrativeelectronic system 800 according to the present invention. The electronicsystem 800 may comprise, for example, a computer or computer hardwarecomponent, a server or other networking hardware component, a cellulartelephone, a digital camera, a personal digital assistant (PDAs),portable media (e.g., music) player, etc. The electronic system 800includes at least one memory device 801. The electronic system 800further may include at least one electronic signal processor device 802(often referred to as a “microprocessor”). At least one of theelectronic signal processor device 802 and the at least one memorydevice 801 may comprise, for example, an embodiment of the semiconductordevice 300, 400, 500, 600, 700 described above. In other words, at leastone of the electronic signal processor device 802 and the at least onememory device 801 may comprise an embodiment of a semiconductor deviceincluding an SMOI structure having a buried conductive material aspreviously described in relation to the semiconductor devices 300, 400,500, 600, 700 shown in FIGS. 39-43. The electronic system 800 mayfurther include one or more input devices 804 for inputting informationinto the electronic system 800 by a user, such as, for example, a mouseor other pointing device, a keyboard, a touchpad, a button, or a controlpanel. The electronic system 800 may further include one or more outputdevices 806 for outputting information (e.g., visual or audio output) toa user such as, for example, a monitor, a display, a printer, an audiooutput jack, a speaker, etc. In some embodiments, the input device 804and the output device 806 may comprise a single touchscreen device thatcan be used both to input information to the electronic system 800 andto output visual information to a user. The one or more input devices804 and output devices 806 may communicate electrically with at leastone of the memory device 801 and the electronic signal processor device802.

CONCLUSION

In some embodiments, the present invention includessemiconductor-metal-on-insulator (SMOI) structures, devices includingsuch structures and methods for forming such structures. The SMOIstructures may include an insulator material on a first semiconductorsubstrate, an amorphous silicon material bonded to the insulatormaterial, a conductive material over the amorphous silicon material anda second semiconductor substrate over the conductive material. Adielectric material may also be disposed between the conductive materialand the second semiconductor substrate. In other embodiments, theconductive material may be patterned and adjacent portions of thepatterned conductive material may be separated from one another by adielectric material.

In additional embodiments, the present invention includes an SMOI thatincludes an insulator material on a first semiconductor substrate, anamorphous germanium material bonded to the insulator material, aconductive material over the amorphous germanium material and a secondsemiconductor substrate over the conductive material.

In additional embodiments, the present invention includes an SMOIstructure that includes an insulator material on a first semiconductorsubstrate, a conductive material over the insulator material, at leastone portion of an epitaxial silicon material and at least one portion ofa silicon-germanium material, the at least one portion of the epitaxialsilicon material or the at least one portion of the silicon-germaniummaterial bonded to the insulator material, and a second semiconductorsubstrate over the conductive material. The insulator material may beformed of an oxide material having an amorphous silicon material formedthereon.

In additional embodiments, the present invention includes an SMOIstructure including a first semiconductor substrate, at least oneportion of an oxide material and at least one portion of a conductivematerial formed over the first semiconductor substrate, and a secondsemiconductor substrate formed over the conductive material.

In yet further embodiments, the present invention includes asemiconductor device that includes an insulator material on a firstsemiconductor substrate, an amorphous silicon material bonded to theinsulator material, a conductive material over the amorphous siliconmaterial, a second semiconductor substrate over the conductive material,and a memory cell on the second silicon substrate. The conductivematerial may form an interconnect. A logic device may also be formed onthe first semiconductor substrate. In some embodiments, a dielectricmaterial may be disposed between the conductive material and the secondsemiconductor substrate. The memory cell of the semiconductor device mayinclude a floating body memory cell which includes an active areasubstantially physically isolated by an insulating material, a drainregion and a source region formed within the active area, a high-kdielectric material formed on an active area between the drain regionand the source region and a metal gate formed on the high-k dielectric.

In yet further embodiments, the present invention includes methods offorming an SMOI structure that include forming an acceptor wafercomprising an insulator material formed over a first semiconductorsubstrate, forming a donor wafer comprising a conductive material over aprecursor semiconductor substrate, an amorphous silicon material overthe conductive material, and an implanted zone within the precursorsemiconductor substrate, bonding the amorphous silicon material of thedonor wafer to the insulator material of the acceptor wafer, andremoving a portion of the precursor semiconductor substrate proximatethe implanted zone within the precursor semiconductor substrate. In someembodiments, at least one surface of the amorphous silicon material anda surface of the insulator material may be treated with a chemical, aplasma, or an implant activation before bonding the amorphous siliconmaterial of the donor wafer to the insulator material.

In yet further embodiments, the present invention includes a method offabricating a semiconductor device including forming an acceptor wafercomprising an insulator material formed over a first semiconductorsubstrate, forming a donor wafer comprising a conductive material over aprecursor semiconductor substrate, an amorphous silicon material overthe conductive material, and an implanted zone within the precursorsemiconductor substrate, bonding the amorphous silicon material of thedonor wafer to the insulator material of the acceptor wafer, removing aportion of the precursor semiconductor substrate proximate the implantedzone to form a second semiconductor substrate, and fabricating at leastone memory cell on the second semiconductor substrate.

In yet further embodiments, the present invention includes methods offorming an SMOI structure that include forming an acceptor wafercomprising an insulator material formed over a first semiconductorsubstrate, forming a donor wafer comprising a conductive material over aprecursor semiconductor substrate, an amorphous germanium material overthe conductive material, and an implanted zone within the precursorsemiconductor substrate, bonding the amorphous germanium material of thedonor wafer to the insulator material of the acceptor wafer, andremoving a portion of the precursor semiconductor substrate proximatethe implanted zone within the precursor semiconductor substrate.

While the invention is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, the invention is not intended to be limited to the particularforms disclosed. Rather, the invention is to cover all modifications,equivalents, and alternatives falling within the scope of the inventionas defined by the following appended claims and their legal equivalents.

What is claimed is:
 1. A semiconductor-metal-on-insulator structurecomprising: an insulator material on a first semiconductor substrate; anamorphous germanium material bonded to the insulator material; aconductive material over the amorphous germanium material; and a secondsemiconductor substrate over the conductive material.
 2. Asemiconductor-metal-on-insulator structure comprising: an insulatormaterial on a first semiconductor substrate; a conductive material overthe insulator material; an amorphous silicon material over theconductive material; and a second semiconductor substrate over theconductive material.
 3. The semiconductor-metal-on-insulator structureof claim 2, further comprising a bonding material disposed between theconductive material and the amorphous silicon material.
 4. Thesemiconductor-metal-on-insulator structure of claim 3, wherein thebonding material comprises at least one of an additional amorphoussilicon material and an oxide material.
 5. Asemiconductor-metal-on-insulator structure comprising: an insulatormaterial on a first semiconductor substrate; a conductive material overthe insulator material; at least one portion of an epitaxial siliconmaterial and at least one portion of a silicon-germanium material, theat least one portion of the epitaxial silicon material or the at leastone portion of the silicon-germanium material bonded to the insulatormaterial; and a second semiconductor substrate over the conductivematerial.
 6. The semiconductor-metal-on-insulator structure of claim 5,wherein the insulator material comprises an oxide material having anamorphous silicon material formed thereon.
 7. Asemiconductor-metal-on-insulator structure comprising: a firstsemiconductor substrate; at least one portion of an oxide material andat least one portion of a conductive material formed over the firstsemiconductor substrate; and a second semiconductor substrate formedover the conductive material.
 8. A method for fabricating asemiconductor-metal-on-insulator structure, comprising: forming anacceptor wafer comprising an insulator material formed over a firstsemiconductor substrate; forming a donor wafer comprising a conductivematerial over a precursor semiconductor substrate, an amorphous siliconmaterial over the conductive material, and an implanted zone within theprecursor semiconductor substrate; bonding the amorphous siliconmaterial of the donor wafer to the insulator material of the acceptorwafer; and removing a portion of the precursor semiconductor substrateproximate the implanted zone within the precursor semiconductorsubstrate.
 9. The method of claim 8, further comprising treating atleast one of a surface of the amorphous silicon material and a surfaceof the insulator material with a chemical, a plasma, or an implantactivation before bonding the amorphous silicon material of the donorwafer to the insulator material of the acceptor wafer.
 10. The method ofclaim 8, wherein forming an acceptor wafer comprising an insulatormaterial formed over a first semiconductor substrate comprises formingan oxide material over a first semiconductor substrate comprisingcrystalline silicon.
 11. The method of claim 8, wherein forming a donorwafer comprising a conductive material over a precursor semiconductorsubstrate, an amorphous silicon material over the conductive material,and an implanted zone within the precursor semiconductor substratecomprises forming a conductive material over a crystalline siliconsubstrate, an amorphous silicon material over the conductive material,and a hydrogen-implanted zone within the crystalline silicon substrate.12. The method of claim 8, wherein forming a donor wafer furthercomprises forming a dielectric material between the conductive materialand the precursor semiconductor substrate.
 13. The method of claim 8,wherein forming a donor wafer comprising a conductive material over aprecursor semiconductor substrate comprises forming a non-reactiveconductive material over the precursor semiconductor substrate and areactive conductive material over the non-reactive conductive materialand reacting the reactive conductive material with the amorphous siliconmaterial of the donor wafer to form a conductive silicide material. 14.The method of claim 8, wherein forming the conductive material over theprecursor semiconductor substrate comprises: depositing the conductivematerial over the precursor semiconductor substrate; forming a capmaterial over the conductive material; patterning the cap material andthe conductive material; and forming a dielectric material betweenadjacent portions of the patterned cap material and patterned conductivematerial.
 15. The method of claim 8, wherein forming the donor waferfurther comprises forming at least one portion of an epitaxial siliconmaterial and at least one portion of a silicon-germanium materialbetween the conductive material and the amorphous silicon material. 16.The method of claim 8, wherein forming the donor wafer further comprisesforming at least one portion of an oxide material and at least oneportion of a nitride material between the conductive material and theamorphous silicon material.
 17. A method of fabricating a semiconductordevice, comprising: forming an acceptor wafer comprising an insulatormaterial formed over a first semiconductor substrate; forming a donorwafer comprising a conductive material over a precursor semiconductorsubstrate, an amorphous silicon material over the conductive material,and an implanted zone within the precursor semiconductor substrate;bonding the amorphous silicon material of the donor wafer to theinsulator material of the acceptor wafer; removing a portion of theprecursor semiconductor substrate proximate the implanted zone to form asecond semiconductor substrate; and fabricating at least one memory cellon the second semiconductor substrate.
 18. The method of claim 17,further comprising patterning the conductive material to form at leastone of a buried word line and a buried bit line.
 19. The method of claim17, wherein fabricating at least one memory cell on the secondsemiconductor substrate comprises: forming an active area from a portionof the second semiconductor substrate substantially surrounded on thesides and bottom by an additional insulator material; forming a high-kgate dielectric and a metal gate on the active area; and forming asource region and a drain region in the active area.
 20. The method ofclaim 17, wherein fabricating at least one memory cell on the secondsemiconductor substrate comprises: etching the second semiconductorsubstrate to form at least one pillar; forming a source region, anactive area, and a drain region in the at least one pillar; and forminga gate dielectric and a gate on the active area.
 21. The method of claim17, wherein fabricating at least one memory cell on the secondsemiconductor substrate comprises: forming a diode in the secondsemiconductor substrate; and forming a bottom electrode, a memorymedium, and a top electrode on the diode.
 22. A method for fabricating asemiconductor-metal-on-insulator structure, comprising: forming anacceptor wafer comprising an insulator material formed over a firstsemiconductor substrate; forming a donor wafer comprising a conductivematerial over a precursor semiconductor substrate, an amorphousgermanium material over the conductive material, and an implanted zonewithin the precursor semiconductor substrate; bonding the amorphousgermanium material of the donor wafer to the insulator material of theacceptor wafer; and removing a portion of the precursor semiconductorsubstrate proximate the implanted zone within the precursorsemiconductor substrate.